Effect of Sb Addition on the Mechanical and Structural Behaviour of Sn-Bi alloy

Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys

Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

Enhancement of Structural and Creep Properties of Sn-5 wt% Zn Solder Reinforced with Nano-metric Particles of Al2O3

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions