Effects of Physical Sputtering and Annealing Temperature on Surface Behaviourof Cu-10wt.%Ni Alloy

Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys

MECHANISM OF HEAT TRANSFER OF THIN INDIUM FILMS

THE STRUCTURE AND OPTICAL PROPERTIES OF CUPROUS TELLURIDE THIN FILMS

STRUCTURAL AND ELECTRICAL TRANSPORT PROPERTIES OF SnTe FILMS

Transient Creep and Creep Recovery Behaviour of Cu-2wt%Sn Alloy Near the Transformation Temperature

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

AN X-RAY INVESTIGATION OF VACUUM-EVAPORATED AL-FILMS IN RELATION TO SOME PREPARATION PARAMETERS

Investigation of Thermophysical Properties of CuFeS2 Nanoparticles Prepared by Pulsed Laser Ablation Technique.

Microjoining developments of ASS316L/AZ31 TLP bonds using Cu and Ni high temperature solid state diffusion