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Microjoining developments of ASS316L/AZ31 TLP bonds using Cu and Ni high temperature solid state diffusion

Article

Last updated: 22 Jan 2023

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Abstract

Dissimilar joining of austenitic stainless steels to magnesium alloys has recently attained significant attention for the reasons of decreasing the environmental impacts by reducing vehicles emissions and minimizing fuel consumption while maintaining the requireddesign level of mechanical characteristics. This research work is directed toward microscale joining enhancement of the 316 L/(Cu or Ni foils) solid interface through the formation of reaction layers through high temperature solid-state diffusion at 900oC for 15min. Afterward, transient liquid phase bonding (TLP) with AZ31 took place at 530oC and 510oC for 20min using Cu and Ni foils, respectively. The scanning electron microscopy analyses revealed formation of metallurgical micro-reaction films between 316L steel and either Cu or Ni interlayers. Formation of these films enhanced the subsequent TLP bonding with the magnesium alloy AZ31. High temperature solid state interlayer diffusion increases the joint shear strength by 30% when using Cu interlayer and 67% when using Ni interlayer relative to those obtained without the high temperature solid state diffusion stage.

DOI

10.21608/ejmtc.2019.12015.1114

Keywords

Diffusion bonding, magnesium alloy, Microstructure, stainless steel, TLP

Authors

First Name

Waled

Last Name

Elthalabawy

MiddleName

Mohamed

Affiliation

Department of Material Science and Technology, Military Technical Collage,

Email

elthalabawy@mtc.edu.eg

City

Cairo

Orcid

0000-0002-2421-5888

Volume

3

Article Issue

1

Related Issue

7323

Issue Date

2019-03-01

Receive Date

2019-09-09

Publish Date

2019-03-01

Page Start

37

Page End

41

Print ISSN

2357-0954

Online ISSN

2357-0946

Link

https://ejmtc.journals.ekb.eg/article_47516.html

Detail API

https://ejmtc.journals.ekb.eg/service?article_code=47516

Order

5

Type

Original Article

Type Code

307

Publication Type

Journal

Publication Title

Journal of Engineering Science and Military Technologies

Publication Link

https://ejmtc.journals.ekb.eg/

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Article

Created At

22 Jan 2023