Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders

Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy