Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Transient Creep Characteristics in Pb-Sn-Zn Ternary Alloys

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

The Temperature Dependence of the Transient Creep of Cd-2wt.% Sn Alloy

Microstructure Changes and Steady State Creep Characteristics in the Superplastic Sn-5wt.% Bi alloy During Transition