‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

Effect of Sb Addition on the Mechanical and Structural Behaviour of Sn-Bi alloy

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

Effect of Annealing Temperature on the Electrical Resistivity of Sn-12wt%Sb Lead Free Solder Alloy

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders