Enhancement of Heat Transfer for Electronic Components in Horizontal Channel by Passive Cooling.

Natural Convection Air Cooling of Electronic Components in Partially Top Vented Enclosures.

Theoretical Study of Mixed Convection Cooling of Microprocessor Using CuO Nanofluid.

Heat Transfer Performance of a Two-Phase Closed Thermosyphon.

Thermal Performance of Loop Thermosyphon Charged by Nanofluid for Cooling Electronic Component.

Study of Heat Pipe Performance with Water/ Water-Based Nanofluid.

CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING

THERMAL PERFORMANCE INVESTIGATION OF PLATE-FINNED VAPOR CHAMBER HEAT SINK WITH USING DIFFERENT FLUIDS

Natural Convection Heat Transfer from Discrete Heat Sources Mounted in Rectangular Enclosure Surrounded by a Single-Phase Liquid Coolant.

The Influence of Electro-convection on the Efficiency of Finned Air Coolers under Condition of Frost Formation.