The vapor chamber (VC) is considered one of the most effective approaches for heat dissipation in electronic components. This study investigates experimentally the thermal characteristics of a novel wickless vapor chamber integrated with a plate-finned heat sink (PFHS) to identify the optimal operating conditions of VC and enhance this condition by using different fluids. The study examines the influence of various parameters such as Reynolds number, heat input, filling ratio, operating vacuum pressure, and different fluids (distilled water and propylene glycol solutions) on VC's thermal performance. To prove the effectiveness of the VC, the thermal characteristics of the plate-finned heat sink (PFHS) with and without VC are compared. The results demonstrate that utilizing a VC leads to a significantly more uniform temperature distribution along the base of the PFHS and low overall temperatures. Conversely, in the absence of a VC, the PFHS exhibits a non-uniform temperature distribution, with a bell-shaped profile and concentrated high temperatures at the center at the same operating conditions. Based on the experimental results, over the heat inputs range (10 – 90 W), the lowest thermal resistance and heater temperature occur at 50% filling ratio (FR) with the operating vacuum pressure = 1kPa. The VC's thermal performance improves with using propylene glycol solution at low heat input
 
Special Issue of AEIC 2024 (Mechanical & Chemical and Material Engineering  Session)