Cooling of Electronic equipment's is an attractive
research area in engineering applications. Continued
minimization of electronic system has resulted in dramatic
increase in the amount of heat generated per unit volume, The
aim of this study is to use computational Fluid Dynamics in
order to draw a CFD model for forced cooling conjugate heat
transfer analyses in heat generating electronic systems and
compare between a collection of actual commercial heat sinks
different from in geometry ,material , and number of fins .A
complete computer chassis model with heat sinks and fans
inside was created and parametric analyses were performed to
compare the effects of different turbulence models, mesh
resolutions, and radiative heat transfer. The CFD software was
used, ANSYS Icepack 18.0 for preprocessing and fluent for
solution and post processing. The road map was applied to five
different heat sinks and another three heat sink as a validation
modeled into the full chassis. Numerical results were compared
with the available experimental data and they were in good
agreement.