Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Transient Creep Characteristics in Pb-Sn-Zn Ternary Alloys

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Transient Creep and Creep Recovery Behaviour of Cu-2wt%Sn Alloy Near the Transformation Temperature

Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy