Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Effect of Sb Addition on the Mechanical and Structural Behaviour of Sn-Bi alloy

Enhancement of Structural and Creep Properties of Sn-5 wt% Zn Solder Reinforced with Nano-metric Particles of Al2O3

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders