Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Transient Creep Characteristics in Pb-Sn-Zn Ternary Alloys

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications