Solid-state diffusion enhancement of liquid phase joints between austenitic stainless steel alloy and magnesium alloy

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

LIQUID PHASE SINTERING USING SUPER ALLOYS

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

EFFECT OF BRAZING ALLOYS ON MECHANICAL AND TR1BOLOGICAL BEHAVIOR OF Ni-MO SINTERED STEEL

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Enhancement of Structural and Creep Properties of Sn-5 wt% Zn Solder Reinforced with Nano-metric Particles of Al2O3

CONTRIBUTION TO THE DEVELOPMENT OF IN718 ALLOY