Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Transient Creep and Creep Recovery Behaviour of Cu-2wt%Sn Alloy Near the Transformation Temperature

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Enhancement of Structural and Creep Properties of Sn-5 wt% Zn Solder Reinforced with Nano-metric Particles of Al2O3

Transient Creep Characteristics in Pb-Sn-Zn Ternary Alloys

Grain Size Dependence of Steady State Creep Rate in Sn-1 wt% Zn Alloy

Effect of addition of GO Nanoparticles on the tensile properties and deformation temperature of Sn-3.5Ag-0.7Cu lead free solder alloy

Impact of pre-torsional deformation and nanoparticles addition on the mechanical behavior of Sn-based soft solder alloy