Effect of Ternary Addition on Characteristics of Pb-Sn Base Alloys

Effect of Sb Addition on the Mechanical and Structural Behaviour of Sn-Bi alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of Structural Transformation on the Mechanical and Electrical Properties of Quenched (Pb - 1.5 wt % Sb) Alloy

Effect of Annealing Temperature on the Electrical Resistivity of Sn-12wt%Sb Lead Free Solder Alloy