Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effect of Antimony Addition on Characteristics of Melt - Spun Pb - Sn Alloy

Effect of Microstructural Variations Developed by heat Treatment On the Mechanical and Electrical Properties of (Pb-1.5 wt % Sb)

Resoftening and Resistivity Variations in Thermally Deformed Cu-Sn and Cu-Sn-Zn Alloys

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders

Effect of Ternary Addition on Characteristics of Pb-Sn Base Alloys