Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

Transient Creep Characteristics in Pb-Sn-Zn Ternary Alloys

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

Grain Size Dependence of Steady State Creep Rate in Sn-1 wt% Zn Alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Effect of Ternary Addition on Characteristics of Pb-Sn Base Alloys

Transient Creep and Creep Recovery Behaviour of Cu-2wt%Sn Alloy Near the Transformation Temperature

Steady State Creep Characteristics of Sn-5wt% Sb-(0.5-3) wt% Ag Solders