EFFECT OF EQUAL CHANNEL ANGULAR PRESSING (ECAP) ON MECHANICAL PROPERTIES AND WEAR BEHAVIOR OF AL-7075 ALLOY

WEAR RESISTANCE OPTIMIZATION OF COPPER, LEAD, TIN ALLOYS

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

Influence of ECAP Parameters on Electrical Conductivity and Hardness of Pure Cu

Effect of Sb Addition on the Mechanical and Structural Behaviour of Sn-Bi alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Impact of pre-torsional deformation and nanoparticles addition on the mechanical behavior of Sn-based soft solder alloy

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys