EFFECT OF EQUAL CHANNEL ANGULAR PRESSING (ECAP) ON MECHANICAL PROPERTIES AND WEAR BEHAVIOR OF AL-7075 ALLOY

WEAR RESISTANCE OPTIMIZATION OF COPPER, LEAD, TIN ALLOYS

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effect of Copper and Copper oxide Nanoparticles on The Transient Creep Properties of Sn-4Zn alloy

Effect of Sb Addition on the Mechanical and Structural Behaviour of Sn-Bi alloy

Influence of ECAP Parameters on Electrical Conductivity and Hardness of Pure Cu

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Impact of pre-torsional deformation and nanoparticles addition on the mechanical behavior of Sn-based soft solder alloy

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Investigation of Microstructure and Mechanical Properties of Different Nano - Particles Doped Sn-Zn Lead-Free Solder Alloys