The physical properties of Chitosan in as received form were investigated by different techniques. XRD analysis of the powder form confirmed the amorphous structure. Thermal stability was evaluated through Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). DSC measurements identified an endothermic peak associated with water loss at 57 °C and an exothermic peak at 308 °C attributed to the decomposition of the Chitosan backbone. The dielectric properties, including dielectric constant and AC conduction mechanisms, were investigated within a temperature range of 305 – 395 K. Both the real and imaginary parts of the complex dielectric constant exhibited a decreasing trend with increasing frequency at a fixed temperature. Furthermore, the AC conduction mechanism was analyzed. The Bulk Modulus and conduction mechanism were also investigated. Finally, emission spectra were examined.The physical properties of Chitosan in as received form were investigated by different techniques. XRD analysis of the powder form confirmed the amorphous structure. Thermal stability was evaluated through Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). DSC measurements identified an endothermic peak associated with water loss at 57 °C and an exothermic peak at 308 °C attributed to the decomposition of the Chitosan backbone. The dielectric properties, including dielectric constant and AC conduction mechanisms, were investigated within a temperature range of 305 – 395 K. Both the real and imaginary parts of the complex dielectric constant exhibited a decreasing trend with increasing frequency at a fixed temperature. Furthermore, the AC conduction mechanism was analyzed.