Abstract    Introduction: Ceramic brackets are tough to be removed. Consequently, their removal becomes more difficult and time-consuming to run an orthodontic office, and risky, since enamel may be damaged. The adoption of novel debonding processes for ceramic brackets is intended to limit the danger of damaging the enamel structure. Ceramic bracket's and enamel's bonding compound may be weakened by laser, allowing brackets to be removed without injuring the enamel. However, the temperature of the tooth surface may be raised by using laser, in particular. To weaken the link between the bracket and the enamel without permanently damaging it harming the pulp, the appropriate laser's output power and time of application must be determined. Aim: To see how effective a 940-nm diode laser was at debonding ceramic brackets. Materials and Methods: Sixty-six premolar teeth were fitted with ceramic brackets come in two styles (monocrystalline and polycrystalline). Brackets in the experimental groups were treated with a diode laser. Shear bond strength and heat effects on the pulp chamber were tested at two laser energy levels: 2W and 5W. ANOVA analysis was used. Results: Polycrystalline brackets rendered the diode laser ineffectual radiated by 2W and effective with polycrystalline brackets radiated at 5W in considerably (P≤0.05) decreasing shear bond strength; and efficient in decreasing shear bond strength in monocrystalline brackets (P≤ 0.05). There were no significant differences in the adhesive remnant index comparing the adhesive remnants of the groups studied. There was significant increase in intrapulpal t temperature but beyond the critical temperature elevation 5.5 C. Conclusion: Diode laser reduced both the critical pulp temperature and the debonding force required for monocrystalline brackets and polycrystalline brackets radiated by the 5W laser.