Transient Creep and Creep Recovery Behaviour of Cu-2wt%Sn Alloy Near the Transformation Temperature

Transient Creep Characteristics in Pb-Sn-Zn Ternary Alloys

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Creep and Structure Parameters Near the Transformation Temperature of Sn-1 wt% Pb Alloy

Effect of Annealing Temperature on the Electrical Resistivity of Sn-12wt%Sb Lead Free Solder Alloy

Creep behavior of β Cu-Zn Alloys

The Temperature Dependence of the Transient Creep of Cd-2wt.% Sn Alloy

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Effect of Microstructural Variations Developed by heat Treatment On the Mechanical and Electrical Properties of (Pb-1.5 wt % Sb)