There has been deep interest by research workers in the thermal characteristics of
heat sinks as cooling devices in certain engineering systems (e.g. computer
microprocessors and motherboards). The main emphasis has been on how to
enhance the heat transfer rate from such cooling devices. Finned surfaces were one
obvious solution in this case. Vapor chamber heat sinks may also be another
solution.
This paper gives an over view of up-to-date published research in the area of flat
plate type heat sinks provided with fins. Some 40 articles were reviewed and
examined, covering various aspects of the subject. Each article was critically
evaluated. Aspects requiring further work and deeper insight were spotted, drawing
attention to their importance. Suggestions for possible means thought to augment
the heat transfer rate of heat sinks were postulated.