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34326

Thermal modeling of a high fill-factor micromachined bolometer for thermal imaging applications

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Last updated: 24 Dec 2024

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Abstract

Abstract:
Infrared radiation bolometer which is made of thin film of a aSi:H is thermally modeled
using 3-d finite element analysis method (FEA) .This bolometer is realized in a
multilevel electro thermal structure having high fill factor. Using the multilevel
structure, thermal isolation can be indepentely optimized without sacrificing IR
absorption area. The design show that thermal time constant of 12.95 ms, responsivity
of 4.65X103V/W,and detcetivity of 7.97X108cm Hz1/2w-1 can be achieved in
50μmx50μm michromachined structure.

DOI

10.21608/iceeng.2008.34326

Keywords

Bolometer-Infreared- Thermal Modeling-Micromachined-Detectors-FEA

Authors

First Name

M.

Last Name

Safy

MiddleName

-

Affiliation

Egyptian Armed Forces.

Email

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City

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Orcid

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First Name

A.

Last Name

Zaky

MiddleName

Hafz

Affiliation

Egyptian Armed Forces.

Email

-

City

-

Orcid

-

First Name

A.

Last Name

Mitkes

MiddleName

-

Affiliation

Egyptian Armed Forces.

Email

-

City

-

Orcid

-

Volume

6

Article Issue

6th International Conference on Electrical Engineering ICEENG 2008

Related Issue

5700

Issue Date

2008-05-01

Receive Date

2019-06-11

Publish Date

2008-05-01

Page Start

1

Page End

9

Print ISSN

2636-4433

Online ISSN

2636-4441

Article File

ICEENG_Volume 6_Issue 6th International Conference on Electrical Engineering ICE….pdf

PDF . 124.4kB

Link

https://iceeng.journals.ekb.eg/article_34326.html

Detail API

https://iceeng.journals.ekb.eg/service?article_code=34326

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81

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Original Article

Type Code

833

Publication Type

Journal

Publication Title

The International Conference on Electrical Engineering

Publication Link

https://iceeng.journals.ekb.eg/

MainTitle

Thermal modeling of a high fill-factor micromachined bolometer for thermal imaging applications

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Article

Created At

22 Jan 2023