ABSTRACT
The rapid developments in electronics and semiconductors processing led to the use
of very compact and precise units with relatively large power and excellent
performance. But still the temperature sensitivity and control of such special
materials are pronounced and hence its cooling is essential for better performance
and smooth operation. Moreover, the dimensions of these electronic components
are small and the surface available for heat transfer is also small. Hence, compact
cooling means are necessary for effective heat removal from these sensitive
materials. In the present work, various cooling technologies applied in electronic
systems are analyzed and discussed in view of their cooling potentials and
compactness necessary by semiconductor systems. The heat pipe technology was
selected in the present work as an efficient tool for heat removal from electronic chips
due to its direct cooling via phase change of the working fluid inside and without any
external pumping power. Simplified design calculations are also given in the paper
for the selected copper-water heat pipe for thermal cooling of an electronic system.