Abstract:
Brass-Al-Brass foils hot isostatically pressed, HIPPed, at solid state for lamellar composite processing. However, it resolves lamellar composite structures, macroscopic and microscopic evidence of shape memory, SMA, alloys are established. The arrangement and architectural behavior of metal matrix composite introduced, however it has a potential effect on the final structure. Ply number as well as design assembly are dominant for either lamellar metal matrix composite or delocalized shape memory alloy embedded within composite structure. This phenomenon is rarely observed in lamellar composite processing or in Cu Zn Al SMA. The macrostructurall analysis performed on the HIPPed structures showed the possibilities for the application of this technique in copper based shape memory alloy. Microstructural observations resolved not only a good interface for bulk joints, but dominant zone of interest ( clear interphase, copper inriched zones, aluminum inriched zones as well as copper-zinc-alumin shape memory ply). Parametric study of a hot isostatic pressing approach in a solid state processing is conducted for the assessment of a new emerging Cu-Zn-Al shape memory alloy delocalized and embedded within lamellar structure. The interphase kinetic of Cu-Zn-Al metal matrix composite as well as effect of alloying elements on composite processing are introduced. Microstructure characterization established with scanning electron microscopy and energy dispersive X-ray spectroscopy, EDX. The results showed that very regular delocalized enriched zones of interests could be obtained in a composite having an interphase morphology and relative percent of alloying elements. Microstructural and compositional analyses on composite specimens showed symmetrical and uniform delocalized microstructure. In this way the possibility of formation of Cu-Zn-Al system either with or without lamellar composite structure processing through the proposed low-cost process is clearly demonstrated. This alloy is produced through a recently proposed HIPing process, which consists mainly of a controlled lamellar architecture in a solid state processing.