In this study, epoxy composites are prepared by the centrifugal mixing method. The effects of Silicon Carbide (SiC) as a reinforcement material due to its weight percentage (wt. %), SiC particle sizes and mixing speed on electrical and thermal conductivity are investigated both experimentally and theoretically. The perfect dispersion of ceramic particles on the surrounding of the sample edge is found to be improved significantly and increases both electrical and thermal Conductivity. Additionally, both are increased with the decrease in the particle size, SiC wt. % and the mixing speed. It can be attributed to the particle to particle adjoining that is created between ceramic particles and epoxy and the electron transporting. Therefore, as the manufacturing of the polymer composite on large scale is more promising ascribable its acceptable cost, low weight and could prepare ease, it can be considered for the industrial heat transfer. Compared to carbonic particles, metallic and ceramic particles are more effective at enhancing the thermal conductivities of polymer nanocomposites.