Deep Eutectic Solvents (DES) have demonstrated enormous potential in the electrodeposition of various materials, including metals and alloys. Usually, gold electroplating solution consists of toxic material of gold cyano compounds. This work demonstrates novel green electroplating of nanogold from Alum: Urea deep eutectic solvent (DES) containing chloro-gold compound (HAuCl4.4H2O). Gold showed one stage redox system in this reduction solution at -0.2V and oxidation and oxidation maximum at -0.3V. The electroplated gold on brass at -0.7V for one and three hours gave a brown-colored layer containing nanogold particles with an average distribution of (31.16-33.44) nm. The crystalline structure of deposited gold is like a cubic crystal with 10 nm size. This work was followed by scanning electron microscopy (Fe-SEM), Atomic Force Microscopy (AFM), Energy Dispersive X-ray analysis (EDX), and X-ray diffraction (XRD).