The major goal of this study is to see how time depositing affects the surface characteristics, composition, and corrosion behaviour of Ni–Cu NMFs that have been deposited. The deposited layer's Ni content ranged from 76 to 85 percent, with copper content ranging from 10 to 19 percent. Potentiodynamic tests, CV, and EIS were used to investigate the corrosion behaviour of these deposited Ni-Cu in 1 M acidic methanol. A typical dendritic morphology was developed using a high current density of 3A/〖cm〗^2 and different deposition times of 30, 90, and 150 sec. The layer deposited at 30 seconds had the lowest corrosion rate of 25.3 mpy, according to the potentiodynamic test. According to CV, when the deposition period rises from 30-150 sec, both the overall charge and forward peak intensity are increasing, indicating a considerable influence on the films' electrochemical activity. The author analysed Rpo to decrease as the applied electrodeposition time increased in the EIS test. At 30 sec, the maximum Rpo was 442.6 ohm, indicating the best corrosion resistance.