Effect of Antimony Addition on Characteristics of Melt - Spun Pb - Sn Alloy

Effect of Addition of Ag and Cu on Strain Rate and Deformation Temperature on the Tensile Properties of Sn-5Sb Solder Alloy

Impact of pre-torsional deformation and nanoparticles addition on the mechanical behavior of Sn-based soft solder alloy

Effect of Structural Transformation on the Mechanical and Electrical Properties of Quenched (Pb - 1.5 wt % Sb) Alloy

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Effect of Ternary Addition on Characteristics of Pb-Sn Base Alloys

Effect of Silver Addition on Transient and Steady State Creep Characteristics of Eutectic Sn-9Zn Binary Alloy

Microstructure, creep deformation behavior and reliability of Sn-6.5wt%Zn-0.3wt%Cu lead free solder after Bi additions

‌Influence of Small Amount of Cu Addition on Microstructure, Deformation Temperature, and the Tensile Behaviour of Sn-9Zn-1.5Ag Lead free Solder Alloy

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders