Finned heat sinks have long been used for cooling purposes in many
engineering systems. Flat plate type sinks have been commonly used for the
cooling of computer components such as microprocessors, motherboards, power
supplies, etc. In this paper, a flat plate type heat sink provided with fins was
examined experimentally. A vapor chamber was located between the heat source
(load) and the sink itself. Several cases were considered: fins of various geometries
and heights, in absence and presence of the vapor chamber, and Reynolds number
levels. Comparisons were held and correlations were derived. The main conclusion
is that using a vapor chamber in addition to fins improves the cooling system
performance significantly.